HOW TO MAKE BALLS ON SOUTHBRIDGE BOTTOM?

rom.by/comment/166072

Thanks mikkey for this links.

I managed to find firm in Serbia that is making holes in stainless steel with high precision that is required for reballing trafarets.
From datasheets of diferent chipsets I found measures between holes and number of holes. Does anybody know what shoul be diameter for holes. On datasheet, for example INTEL FB82801EB, there is information about space between centers of soldering places 1.27mm and diameter of 0.6-0-9mm for each .Should hole in trafaret be 0.9mm in diameter or biger? What diameter of holes for 1mm; 1,0668mm; 1,118 mm spacing I need? I have to provide that information for engineer that is preparing laser cutting.

Help please master gurus:)

I think you need diameter 0.64 soldering bals. I use this balls for reballing chipsets(nForce2/3/4/...; ich6/7/...). For ICH4/5 I use 0.76 soldering balls.

How thick shoul trafaret plate be? I thought that propriate thicknes would be equal to diameter of holes. In this case (ICH4,5...) thicknes is abot 0.76mm? Am I right or U sugesting that it sould be thicker (about 1mm)? I`m litle worry becouse of plate is deforming on high temperatures (350-400 degrees).
You think that I leave 0.76mm holes for ICH 4,5 trafaret?

Topicstarter, I see four ways to have BGA chip with usable for installation balls:

1) Buy new chips - they're coming with balls (as refurbished chips)
2) Buy special trafaret and BGA paste (laser-trafaret.ru, gsmservice.od.ua and others)
3) Buy a pack of balls - it's very useful if you have desoldered chip and need to recover only small number of balls
4) Train your skill to remove chip with all balls on it. It requires some time. I can give you 4 small advices:
a) use flux
b) (I'm assuming that your chip is above your board during desoldering) try to desolder chip with a maximum temperature of board (bottom) and minimum temperature of chip itself (top) - by this way you can get all balls on chip.
c) be sure that all balls are fused before remove of chip
d) and of course, use good heater sources on both sides of board ("good" means they must have enough power, heating area and good temperature control)

About thickness - I think 0.6mm will be quite enough.

I like name of topic

Highlander,
Thank U for exhaustive answer:)
I ordered trafarets to be manufactured professionaly, bought liquid tin and packs of balls, and a looooooot of flux (as U suggested:)
I hope to perfect skill to desolder and resolder chips without burn them or demaging them during process.
I`m very grateful for all help I recive form rom.by gentlman and great patience U have with novices like me, that have many stupid questions:))